Tessa debuts at Intersolar 2025 with robust solutions for solar energy

The hallmark of reliability in construction. Now powering solar energy.

Tessa, a benchmark in steel structures, confirms its participation in Intersolar South America 2025, one of the largest solar energy trade fairs on the continent. The event takes place from August 26 to 28 at Expo Center Norte in São Paulo (SP).

Exhibiting at the fair for the first time, Tessa will present two of its most sought-after solutions for the solar sector: the Carport and the Steel Ground-Mount Structure. Visitors will be able to see up close the robustness, durability and efficiency of the structures made from galvanized steel, which stand out for their safety and weld-free finish, with precise industrial cutting and bending.

One of the highlights of the presentation will be the Tessa Mounting Clamp, an essential component to ensure the firmness and stability of photovoltaic modules on the structures. Developed with the same precision and quality as the brand's steel profiles, the Clamp ensures a reliable fit, easy installation and long-term resistance, making it ideal for small, medium and large-scale solar projects.

Intersolar South America is known for bringing together the main players in the solar PV industry, serving as a strategic showcase for companies seeking connections, partnerships and visibility in a market that continues to grow rapidly in Brazil and Latin America. With its own booth, Tessa promises to present its solutions in an innovative way, highlighting its commitment to quality and to technology applied to building smart structures for clean energy generation.

“Our expectations are very high. Being at Intersolar is a unique opportunity to show Tessa's strength in the solar energy market, a sector in which we have been investing with focus and innovation,” says the company's management.

Want to know more? Visit the Tessa blog and follow all the news about our participation in Intersolar 2025 and the latest innovations in the solar sector.